Semiconductor apparatus and method for manufacturing the same

ABSTRACT

A semiconductor apparatus comprises a gate electrode, a gate insulating layer, a drift region of a first conductivity type formed over a semiconductor substrate of the first conductivity type, a base region of a second conductivity type formed over the drift region, a source region of the first conductivity type formed on the base region and a column region formed in the drift region under the base region, the column region being divided into a plurality of divided portions in depth direction.

This application is a division of co-pending application Ser. No.11/017,754, filed on Dec. 22, 2004, the entire contents of which arehereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the invention

This invention relates to a semiconductor apparatus and a method formanufacturing the same.

2. Description of the Related Art

A vertical power MOSFET (Field Effect Transistor) is known as a MOSFETfor high voltage operation. The power MOSFET has two importantcharacteristics. One is an on-resistance, and the other is a break downvoltage (withstand voltage). There is a trade-off between theon-resistance and the break down voltage. It is difficult for the powerMOSFET to have a high break down voltage and a reduced on-resistance.

Super-junction devices are proposed to achieve the power MOSFET having ahigh break down voltage and a reduced on-resistance.

FIG. 17 is a cross sectional view of the semiconductor apparatus 100having a super-junction structure (SJ structure). As shown in FIG. 17,the semiconductor apparatus 100 comprises a semiconductor substrate 101,a drift region 102, a base region 108, a source region 109, a gate oxidelayer 106A, a gate electrode 107A, an intermediate insulating layer 110,a contact hole 110 a, a source electrode 111, a column region 204 and adrain electrode 112.

The drift region 102 is formed on the semiconductor substrate 101, andoperates as an electric field relaxation layer. The base region 108 isformed on the drift region 102. The source region 109 is selectivelyformed in the surface portion of the base region 108. The gate oxidelayer 106A is formed on a surface of a trench formed in the base region108. The gate electrode 107A is formed on the gate oxide layer 106A. Theintermediate insulating layer 110 is formed over the gate electrode 107Aand the source region 109. The contact hole 110 a is formed in theintermediate insulating layer 110. The source electrode 111 is formedover the intermediate insulating layer 110, and the source electrode 111is electrically connected to the source region 109 via the contact hole110 a. The column region 204 is formed in the drift region 102 under thebase region 108. The drain electrode 112 is formed on the bottom surfaceof the semiconductor substrate 101.

The drift region 102 and the source region 109 have the sameconductivity type as the semiconductor substrate 101 (for example, N orN+ type). The base region 108 and the column region 204 have an oppositeconductivity type to the semiconductor substrate 101 (for example,P-type). The impurity concentration of the column region 204 isapproximately the same as the impurity concentration of the drift region102. The impurity concentration of the entire column region 204 isuniformed.

As shown in FIG. 17, the semiconductor apparatus 100 having the SJstructure is basically the same as a conventional vertical power MOSFET.The difference between the conventional power MOSFET and thesemiconductor apparatus 100 is that the semiconductor apparatus 100 hasthe column region 204.

When a bias voltage is not applied between the gate electrode and thesource electrode and a reverse bias voltage is applied between the drainelectrode and the source electrode, depletion regions are extended fromtwo junctions. One junction is a boundary between the drift region 102and the base region 108, and the other junction is a boundary betweenthe drift region 102 and the column region 204. The semiconductor device100 becomes off state because the depletion regions are extended.

That is, the boundary between the drift region 102 and the column region204 extends in depth direction. The depletion region between the driftregion 102 and the column region 204 is extended in width direction, andthe whole column region 204 and the drift region 102 are depleted whenthe width of the depletion region becomes wider than distance d shown inFIG. 17.

In case that the semiconductor apparatus 100 has the SJ structure andthe distance d is sufficiently short, the break down voltage (withstandvoltage) does not depend on an impurity concentration of the electricfield relaxation layer. Therefore, the reduced on-resistance and thehigh break down voltage are achieved by the semiconductor apparatus 100which has the SJ structure. Japanese unexamined patent publication No.2001-298189 discloses the semiconductor apparatus having the SJstructure.

In the semiconductor apparatus having the SJ structure, the electricfield concentrates at the PN junction under the base region 108 or theregion under the gate oxide layer 106A when the reverse bias voltage isapplied. Therefore, the characteristic of the gate oxide layer 106A isdegraded because an avalanche current flows at above described regions.In case that the gate electrode 107A is formed in a trench as shown inFIG. 17, this problem often occurs.

SUMMARY OF THE INVENTION

According to the aspect of the invention, a semiconductor apparatuscomprises a gate electrode, a gate insulating layer, a drift region of afirst conductivity type formed over a semiconductor substrate of thefirst conductivity type, a base region of a second conductivity typeformed over the drift region, a source region of the first conductivitytype formed on the base region and a column region formed in the driftregion under the base region, the column region being divided into aplurality of divided portions in depth direction.

According to another aspect of the invention, a semiconductor apparatuscomprises a gate electrode, a gate insulating layer, a drift region ofthe first conductivity type formed over a semiconductor substrate of thefirst conductivity type, a base region of a second conductivity typeformed over the drift region, a source region of the first conductivitytype formed on the base region and a column region formed in the driftregion under the base region, the column region having at least oneportion having a higher impurity concentration than an average impurityconcentration of the column region.

According to another aspect of the invention, a method for manufacturinga semiconductor apparatus comprises forming a drift region of a firstconductivity type over a semiconductor substrate of the firstconductivity type, forming a base region of a second conductivity typeover the drift region, forming a gate insulating layer, forming a gateelectrode on the gate insulating layer, forming a source region of thefirst conductivity type on the base region, forming a first dividedportion of a column region in the drift region under the base region andforming a second divided portion of the column region in the driftregion under the base region.

According to another aspect of the invention, a method for manufacturinga semiconductor apparatus comprising, forming a drift region of a firstconductivity type over a semiconductor substrate of the firstconductivity type, forming a base region of a second conductivity typeover the drift region, forming a gate insulating layer, forming a gateelectrode on the gate insulating layer, forming a source region of thefirst conductivity type on the base region, forming a column region inthe drift region under the base region and forming a high impurityconcentration portion in the column region, the high impurityconcentration portion having a higher impurity concentration than anaverage impurity concentration of the column region.

According to the present invention, when the reverse bias voltage isapplied to the semiconductor apparatus, the avalanche current whichflows in the column region does not flow to near the gate electrode.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, advantages and features of the presentinvention will be more apparent from the following description taken inconjunction with the accompanying drawings, in which:

FIG. 1 is a cross sectional view showing the semiconductor apparatus ofthe first embodiment.

FIG. 2 is a cross sectional view showing a method for manufacturing thesemiconductor apparatus of the first embodiment.

FIG. 3 is a cross sectional view showing a method for manufacturing thesemiconductor apparatus of the first embodiment.

FIG. 4 is a cross sectional view showing a method for manufacturing thesemiconductor apparatus of the first embodiment.

FIG. 5 is a cross sectional view showing a method for manufacturing thesemiconductor apparatus of the first embodiment.

FIG. 6 is a cross sectional view showing a method for manufacturing thesemiconductor apparatus of the first embodiment.

FIG. 7 is a cross sectional view showing a method for manufacturing thesemiconductor apparatus of the first embodiment.

FIG. 8 shows a relationship between depth and electric field intensity,and between depth and acceptor concentration.

FIG. 9 is a cross sectional view showing the electric field.

FIG. 10 is a table showing a condition for manufacturing thesemiconductor apparatus.

FIG. 11 is a perspective view showing the column region.

FIG. 12 is a perspective view showing the column region.

FIG. 13 is a cross sectional view showing the semiconductor apparatus ofanother example of the first embodiment.

FIG. 14 is a cross sectional view showing the semiconductor apparatus ofthe second embodiment.

FIG. 15 shows a relationship between depth and electric field intensity,and between depth and acceptor concentration.

FIG. 16 is a table showing a condition for manufacturing thesemiconductor apparatus.

FIG. 17 is a cross sectional view showing the semiconductor apparatus ofthe related art.

PREFERRED EMBODIMENT OF THE INVENTION

The invention will be now described herein with reference toillustrative embodiments. Those skilled in the art will recognize thatmany alternative embodiments can be accomplished using the teachings ofthe present invention and that the invention is not limited to theembodiments illustrated for explanatory purposed.

First Embodiment

FIG. 1 shows a cross sectional view of a semiconductor apparatus 1 ofthe first embodiment. As shown in FIG. 1, the semiconductor apparatus 1is a power MOSFET having a SJ structure and a trench gate. Thesemiconductor apparatus 1 comprises a semiconductor substrate 101, adrift region 102, a base region 108, a source region 109, a gate oxidelayer 106A, a gate electrode 107A, an intermediate insulating layer 110,a contact hole 110a, a source electrode 111, a column region 4 and adrain electrode 112.

The drift region 102 is formed on the semiconductor substrate 101. Thebase region 108 is formed on the drift region 102. The source region 109is selectively formed in the surface portion of the base region 108. Thegate oxide layer 106A is formed on a surface of a trench formed in thebase region 108. The gate electrode 107A is formed on the gate oxidelayer 106A. The intermediate insulating layer 110 is formed over thegate electrode 107A and the source region 109. The contact hole 110 a isformed in the intermediate insulating layer 110. The source electrode111 is formed over the intermediate insulating layer 110, and the sourceelectrode 111 is electrically connected to the source region 109 via thecontact hole 110 a. The column region 4 is formed in the drift region102 under the base region 108. The drain electrode 112 is formed on thebottom surface of the semiconductor substrate 101.

The semiconductor substrate 101, the drift region 102 and the sourceregion 109 have a first conductivity type. The base region 108 and thecolumn region 4 have a second conductivity type. For example, thesemiconductor substrate 101 and the source region 109 are N+ type andthe drift region is N type. The base region and the column region are Ptype, in this embodiment.

In the semiconductor apparatus 1 of this embodiment, the column region 4is divided into a plurality of divided portions. A first divided portion41 and a second divided portion 42 are shown in FIG. 1. As shown in FIG.1, the first divided portion 41 is formed in the drift region 102 apartfrom the second divided portion 42 in a depth direction.

As described above, the semiconductor apparatus 1 has a trench gatestructure. The gate electrode 107A is formed to extend from the baseregion 108 to the drift region 102.

In this embodiment, there are two divided portions. The divided portionwhich is formed at the shallowest portion is the second divided portion42. The bottom of the second divided portion 42 is deeper than thebottom of the gate electrode 107A. If there are divided portions morethan two, the bottom of the divided portion which is formed at theshallowest portion is deeper than the bottom of the gate electrode 107A.

Each of the dose amount of the drift region 102 and the column region 4is adjusted so that the depletion layer between them has a width d whenthe reverse bias voltage is applied.

A method for manufacturing the semiconductor apparatus 1 is describedwith reference to FIG. 2 to FIG. 7.

As shown in FIG. 2, an N type drift region (phosphorous doped region)102 is formed on the heavily doped N type semiconductor substrate 101using an epitaxial growth. The drift region 102 operates as an electricfield relaxation layer.

An oxide layer 113 is formed on the drift region 102 using a CVD method.An opening portion 113a is formed by selectively etching the oxide layer113 using a photolithographic method. The oxide layer 113 with theopening portion 113 a is used as a mask in forming the column region 4.

Then, boron is introduced into the drift region 102 using the oxidelayer 113 as a mask. Plurality times of ion implantation, for example,three times of ion implantation are carried out to form the columnregion 4. The energy of each ion implantation is varied.

For example, the first divided portion (deeper divided portion) 41 isformed by carrying out the first ion implantation with relatively highenergy (please refer to FIG. 3). The lower part 421 of the seconddivided portion 42 is formed by carrying out the second ion implantationof relatively low energy (please refer to FIG. 4).

The, the third ion implantation of low energy is performed to form theupper part 422 of the second divided portion 42. The energy of the thirdion implantation is lower than that of the second ion implantation. Thelower part 421 and the upper part 422 are connected with each other asshown in FIG. 5.

As described above, the column region 4 having a plurality of dividedportions is formed. Two divided portions 41 and 42 are formed in theembodiment; however, it is possible to form more than two dividedportions. The order of the first, second and third ion implantation isnot limited as described above. For example, the low energy ionimplantation may be performed before the high energy ion implantation.

In performing the ion implantation, an ion scattering occurs near theinside surface of the opening portion 113 a. The ion scattering preventsthe first divided portion 41 and the second divided portion 42(including the lower part 421 and the upper part 422) from diffusing toform a spherical shape. The first divided portion 41 and the seconddivided portion 42 diffuse to form a substantial column respectively.

Then, the oxide layer 113 is removed, and the trench 104 is selectivelyformed using a photolithographic method. The gate oxide layer 106 a isformed on the inner surface of the trench 104 using a thermal oxidation.

A polysilicon is formed over the whole surface of the semiconductorsubstrate 101, and the trench 104 is filled with the polysilicon. Then,an etching is performed to remove the polysilicon except for the buriedpolysilicon in the trench 104. The buried polysilicon in the trench 104forms the gate electrode 107A.

Boron is introduced into the drift region 102 by an ion implantationusing the gate electrode 107 a as a mask. The gate electrode 107 worksas a mask of a self-alignment process. The ion implantation makes theupper portion of the drift region 102 the base region 108 of P type.That is, the base region 108 of P type is formed on the drift region102.

Arsenic is selectively introduced into the base region 108 by an ionimplantation using a photolithographic process, and a thermal treatmentis performed. The ion implantation and thermal treatment make the upperperipheral portion of the base region 108 the source region 109 of Ntype. That is, the source region 109 of N type is formed on the baseregion 108. The source region 109 is formed in the upper peripheralportion of the base region 108.

A BPSG (Boro-Phospho-Silicate Glass) layer is formed as an intermediateinsulating layer 110 over the semiconductor substrate 101 using a CVDmethod. The intermediate insulating layer 110 is selectively etchedusing a photolithographic process. The contact hole 110 a is formed overthe base region 108 and the source region 109 as shown in FIG. 1.

An Aluminum layer is formed over the top surface of the semiconductorsubstrate 101 using a sputtering. The contact hole 110 a is filled withthe aluminum and the source electrode 111 is formed on the base region108 and the source region 109. The drain electrode 112 is formed on thebottom surface of the semiconductor substrate 101.

The semiconductor apparatus 1 of this embodiment is fabricated as abovedescribed. The operation of the semiconductor apparatus 1 of theembodiment is described below.

When a bias voltage is not applied between the gate electrode and thesource electrode and a reverse bias voltage is applied between the drainelectrode and the source electrode, depletion regions are extended fromtwo junctions. One junction is a boundary between the drift region 102and the base region 108, and the other junction is a boundary betweenthe drift region 102 and the column region 4. A current does not flowbetween the source and the drain. The semiconductor device 1 becomes offstate because the depletion regions are extended.

That is, a boundary between the drift region 102 and the column region 4extends in-depth direction. The depletion region between the driftregion 102 and the column region 4 is extended in width direction, andthe whole column region 4 and drift region 102 are depleted when thewidth of the depletion region becomes wider than distance d shown inFIG. 1.

On the other hand, when a bias voltage is applied between the gateelectrode and the source electrode, a surface of the base region 108becomes an inverted state. A current flows between the drain electrodeand the source electrode based on a voltage between the drain electrodeand the source electrode. The semiconductor device 1 becomes on state.Ron (on-resistance) depends on resistivity of the drift region 102. Evenif the impurity concentration of the drift region 102 is increased inorder to achieve a reduced on-resistance, when the distance d issufficiently narrow, the drift region 102 and the whole column region 4is depleted. Therefore, degradation of the break down voltage (withstandvoltage) is prevented.

A solid line of FIG. 8 shows a relationship between an electric fieldintensity E and the depth Z. A dashed line of FIG. 8 shows arelationship between an accepter concentration NA and the depth Z.

In FIG. 8, Z1 corresponds to the bottom of the second divided portion42, and Z2 corresponds to the bottom of the first divided portion 41. Asshown in FIG. 8, the electric field intensity E has two peaks at Z1 andZ2.

A PN junction is formed at the bottom of the second divided portion 42.That is, the PN junction is formed at the boundary between the driftregion 102 and the second divided portion 42. As shown in FIG. 8, aconcentration gradient of the acceptor concentration NA is increased atZ1. The electric field intensity E is also increased at Z1 partly.

That is, as the column region 4 is divided into two regions, thesemiconductor apparatus 1 has a portion where the electric fieldintensity is partly increased when the reverse bias voltage is applied.

Thereby, an avalanche breakdown occurs preferentially in the columnregion 4. An avalanche current produced in the column region 4 directlyflows to the source contact via the base region 108.

The relationship between the concentration gradient and the electricfield is now described. The depleted P type region has a negativecharge, and the depleted N type region has a positive charge. As shownin FIG. 9, the electric field Epn is formed from the n type region to ptype region at the PN junction.

A voltage difference Vbi, which corresponds to a built-in potential,exists at the PN junctions. For example, the voltage difference Vbi is0.7-0.8v. The electric field around the PN junction can be found bysolving the Poisson's equation under the condition described above.

Assuming that the impurity concentration (acceptor concentration: NA,donor concentration: ND) is NA=ND=2*10¹⁶ cm⁻³, the maximum electricfield intensity Epn becomes equal to or less than 5*10⁴ V/cm. The abovedescribed impurity concentration is an example of the typical impurityconcentration of the semiconductor apparatus having the SJ structure.

That is, if the PN junction is formed as a result of the divided columnregion, the electric field Epn is added to the voltage Eext which isapplied to the semiconductor apparatus in depth direction.

A critical voltage of the semiconductor apparatus which has the impurityconcentration of NA=ND=2*10¹⁶ cm⁻³ is approximately 3*10⁵ V/cm.Therefore, the influence of the Epn to the whole electric field issignificant.

EXAMPLE OF CONDITION TO FORM THE COLUMN REGION 4

A condition to form the column region is described below as an example.FIG. 10 shows a table of dose amount of the column region, withstandvoltage characteristics and a withstand voltage definition point. Row Aand B of the table shown in FIG. 10 correspond to the first embodiment,and row C corresponds to a comparative example.

In evaluating the conditions shown in the table of FIG. 10, thesemiconductor apparatus is assumed as follows. The size of the cell is 4um, and the width of the opening portion 113 a is 1 um. The openingportion 113 a is formed in the oxide layer 113 to form the column region4 (please refer to FIG. 2 to FIG. 4). The whole dose amount of thecolumn region is 1.2*10¹³ cm⁻².

In the table shown in FIG. 10, row A represents a condition to form thecolumn region 4 shown in FIG. 1. Three times of ion implantation iscarried out. The dose amount of boron is 4*10¹² atoms/cm² in each ionimplantation. The energy of the first ion implantation is 1500 KeV. Thefirst ion implantation forms the first divided portion 41. The energy ofthe second ion implantation is 500 KeV. The second ion implantationforms the lower part 421 of the second divided portion 42. The energy ofthe third ion implantation is 200 KeV. The third ion implantation formsthe upper part 422 of the second divided portion 42. The impurityconcentration of the column region 4(41,421,422) becomes 8*10¹⁶ cm⁻³according to the ion implantations. The depth of the bottom of the firstdivided portion 41, that is, the depth of the column region 4, isapproximately 3 um in this example.

In the table shown in FIG. 10, row B represents a condition to form thecolumn region 4 that does not have the upper part 422 of the seconddivided portion 42. That is, the first divided portion 41 and the lowerpart 421 of the second divided portion 42 are formed; however, the upperpart 422 of the second divided portion 42 is not formed. Therefore, twotimes of ion implantation is carried out. The dose amount of boron is6*10¹² atoms/cm² in each ion implantation. The energy of the first ionimplantation is 1500 KeV. The first ion implantation forms the firstdivided portion 41. The energy of the second ion implantation is 500KeV. The second ion implantation forms second divided portion 42. Theimpurity concentration of the column region 4(41,421) becomes 1.2*10¹⁷cm⁻³ according to the ion implantations.

In the table shown in FIG. 10, row C represents a condition to form thecolumn region of the comparative example. In the comparative example,the column region is not divided. That is, the first divided portion 41and the second divided portion 42 are connected. In the comparativeexample, four times of ion implantation is carried out. The dose amountof boron is 3*10¹² atoms/cm² in each ion implantation. The energy of thefirst ion implantation is 1500 KeV. The first ion implantation forms thefirst divided portion 41. The energy of the second ion implantation is1000 KeV. The second ion implantation forms a connecting portion whichconnects the first divided portion 41 and the second divided portion 42.The energy of the third ion implantation is 500 KeV. The third ionimplantation forms the lower part 421 of the second divided portion 42.The energy of the fourth ion implantation is 200 KeV. The fourth ionimplantation forms the upper part 422 of the second divided portion 42.In the comparative example, the impurity concentration of the entirecolumn region 4 is uniformed. The impurity concentration of the columnregion 4 of the comparative example is 6*10¹⁶ cm⁻³.

The withstand voltage of the semiconductor device of the firstembodiment is 73V or 78V as shown in row A and B of FIG. 10. That is,the withstand voltage is substantially the same as the comparativeexample, that is shown in row C of FIG. 10.

As shown in row A and B of FIG. 10, the withstand voltage definitionpoint is located in the column region when the column region is divided.More precisely, the withstand voltage definition point is located at thePN junction on the bottom of the second divided portion 42. Therefore,the avalanche current flows in the column region when the column regionis divided, and the gate oxide layer 106A is not damaged.

On the other hand, when the column region is not divided as shown in rowC of FIG. 10, the withstand voltage definition point is located at thebottom of the trench gate (This location corresponds to the bottom oftrench 104 of FIG. 1). Therefore, the avalanche current flows near thegate oxide layer 106A, and the gate oxide layer 106A may be damagedbecause of the avalanche current.

According to the semiconductor apparatus 1 of the first embodiment, thesemiconductor apparatus 1 has a SJ structure which has the column region4 formed in the drift region 102 under the base region 108. Thetrade-off between the break down voltage and the on-resistance isimproved compared with that of the conventional power MOSFET. That is,the withstand voltage characteristics is not degraded, and theon-resistance can be reduced.

The column region 4 is divided into a plurality of divided portions 41and 42 in this embodiment. Therefore, the electric field intensity ispartly increased when the reverse bias voltage is applied. The avalanchebreakdown occurs preferentially in the column region 4. The avalanchecurrent produced in the column region 4 directly flows to the sourcecontact via the base region 108. The avalanche current is notconcentrated near the gate electrode 107A (that is, a portion along thetrench 104 of the base region 108). Therefore, an electrical stress tothe semiconductor apparatus 1, such as a hole implantation to the gateoxide layer 106A, can be avoided. The damage to the gate oxide layer106A can be avoided.

The bottom of the divided portion, which is formed in the shallowestportion, is deeper than the bottom of the gate electrode 107A. When thereverse bias voltage is applied to the semiconductor apparatus 1, theportion where the electric field intensity is partly increased is apartform the bottom of the trench 104. The avalanche current which flows inthe column region 4 does not flow to near the gate electrode 107A.

Especially, this invention is more effective when the divided portionhas higher impurity concentration. In the example shown in row B of FIG.10, even if a repetitive avalanche switching test of high temperature(150 degree centigrade) is carried out, there is little influence on thegate oxide layer, and the gate oxide capacitance versus voltagecharacteristics is not shifted.

The ion scattering occurs near the inside surface of the opening portion113 a. The linear boundaries can be formed between the drift region 102and each of the first divided portion 41 and the second divided portion42 (including lower part 421 and upper part 422).

In the first embodiment, the column region 4 is divided into two dividedportions. The column region 4, however, may be divided into more thantwo divided portions.

The first and second divided portion 41 and 42 may be shaped like acolumn as shown in FIG. 11, or be shaped like a wall which has anextending portion parallel to the top surface of the semiconductorsubstrate 101 as shown in FIG. 12.

OTHER EXAMPLE OF THE FIRST EMBODIMENT

FIG. 13 shows another example of semiconductor apparatus 10 of the firstembodiment.

The semiconductor apparatus 10 is different from the semiconductorapparatus 1 in having a trench 103 at the center portion of the baseregion 108 and the source electrode formed in the trench 103. The otherstructures are the same as the semiconductor apparatus 1 shown inFIG. 1. Descriptions about the same structures of the semiconductorapparatus 1 are omitted.

The method for manufacturing the semiconductor apparatus 10 is slightlydifferent from the method for manufacturing the semiconductor apparatus1. The difference is described below.

As shown in FIG. 2, the oxide layer 113 having the opening 113 a isformed on the drift region 102. The trench 103 is formed by an etchingusing the oxide layer 113 as a mask before the formation of the columnregion 4.

Then, the column region 4 is formed by an ion implantation via trench103 using the oxide layer 113 as a mask. The source electrode 111 isformed to bury the trench 103.

The same advantages of the first embodiment are achieved in thisexample. Further, since the trench 103 is formed in the base region 108,the column region 4 can be formed in a deeper portion even if the energyof the ion implantations are the same as the first embodiment.

Second Embodiment

In the first embodiment, the column region is divided into a pluralityof divided portions. Thereby, the electric field intensity is partlyincreased. In the second embodiment, an impurity concentration of thecolumn region is controlled. At least one high impurity concentrationportion is formed in column region. The high impurity concentrationportion means a portion which has a higher impurity concentration thanthe average impurity concentration of the column region. In the secondembodiment, the electric field intensity is partly increased because ofthe high impurity concentration portion.

As shown in FIG. 14, a semiconductor apparatus 2 of the secondembodiment is different from the semiconductor apparatus 1 in a columnregion 40. The other structures are the same as the semiconductorapparatus 1. Descriptions about the same structures of the semiconductorapparatus 1 are omitted.

As shown in FIG. 14, the column region 40 of the semiconductor apparatus2 has a first portion 43, a second portion 44, a third portion 45 and afourth portion 46. The first portion 43 is the deepest portion, and thefourth portion 46 is the shallowest portion. These portions are formedby carrying out four times of ion implantation.

In the second embodiment, at least one of four portions (a first portion43, a second portion 44, a third portion 45 and a fourth portion 46) hasa higher impurity concentration than that of other portions. Thereby,the column region 40 has the high impurity concentration portion.

The high impurity concentration portion is formed deeper than the bottomof the trench 104. In this embodiment, the second portion 44 has thehigher impurity concentration.

A solid line of FIG. 15 shows a relationship between an electric fieldintensity E and the depth Z when the reverse bias voltage is applied. Adashed line of FIG. 15 shows a relationship between an accepterconcentration NA and the depth Z when the reverse bias voltage isapplied.

In FIG. 15, Z3 corresponds to the boundary between the first portion 43and the second portion 44, and Z4 corresponds to the bottom of the firstportion 43. As shown in FIG. 15, the electric field intensity E has twopeaks at Z3 and Z4. The electric field intensity of Z3 is higher thanthat of Z4.

Therefore, the electric field intensity is partly increased when thereverse bias voltage is applied. The avalanche breakdown occurspreferentially in the column region 40. The avalanche current producedin the column region 40 directly flows to the source contact via thebase region 108. The avalanche current is not concentrated near the gateelectrode 107A. The gate oxide layer 106A is not damaged.

A condition to form the column region 40 is described below. FIG. 16shows a table of a dose amount of the column region 40, withstandvoltage characteristics and a withstand voltage definition point of thesecond embodiment.

Row A of the table shown in FIG. 16 corresponds to that the secondportion 44 is the high impurity concentration portion. The dose amountof the second portion is 4 atoms/cm², and the dose amount of the otherportions (the first portion 43, the third portion 45 and the fourthportion 46) are 2*10¹² atoms/cm². The impurity concentration of highimpurity concentration portion becomes 8*10¹⁶ cm⁻³.

Row B of the table corresponds to that the third portion 45 is the highimpurity concentration portion. The dose amount of the third portion 45is 4*10¹² atoms/cm², and the dose amount of the other portions (thefirst portion 43, the second portion 44 and the fourth portion 46) are2*10¹² atoms/cm². The impurity concentration of high impurityconcentration portion becomes 8*10¹⁶ cm⁻³.

Row C of the table corresponds to that the first portion 43 is the highimpurity concentration portion. The dose amount of the first portion 43is 4*10¹² atoms/cm², and the dose amount of the other portions (thesecond portion 44, the third portion 45 and the fourth portion 46) are2*10¹² atoms/cm². If the first portion 43 has the higher impurityconcentration than the other portions, the bottom of the column region40 has the higher impurity concentration portion. The impurityconcentration of high impurity concentration portion becomes 8*10¹⁶cm⁻³.

Row D of the table corresponds to that the high impurity concentrationportion is not formed. The dose amounts of four portions (the firstportion 43, the second portion 44, the third portion 45 and the fourthportion 46) are the same; for example, the dose amount of each portionis 2*10¹² atoms/cm². The average impurity concentration of the columnregion 4 is 4*10¹⁶ cm⁻³ in the example shown in row D.

In the semiconductor device shown in the table of FIG. 16, the size ofthe cell is 4 um, and the width of the opening portion 113 a is 1 um.The opening portion 113 a is formed in the oxide layer 113 to form thecolumn region 40. The whole dose amount of the column region is 1.2*10¹³cm⁻².

As shown in the table of FIG. 16, four times of ion implantation iscarried out. The energy of the first ion implantation is 1500 KeV. Thefirst ion implantation forms the first portion 43. The energy of thesecond ion implantation is 1000 KeV. The second ion implantation formsthe second portion 44. The energy of the third ion implantation is 500KeV. The third ion implantation forms the third portion 45. The energyof the fourth ion implantation is 200 KeV. The fourth ion implantationforms the fourth divided portion 46. The bottom of the column region 40is formed in 3 um depth.

The withstand voltage of the semiconductor device is 69V when the secondportion 43 is the high impurity concentration portion. The withstandvoltage of the semiconductor device is 73V when the third portion 43 isthe high impurity concentration portion. The withstand voltage of thesemiconductor device is 76V when the first portion 43 is the highimpurity concentration portion. The withstand voltage is thesubstantially the same as when the high impurity concentration portionis not formed.

As shown in FIG. 16, the withstand voltage definition point is locatedin the column region 40 when the high impurity concentration portion isformed. More precisely, the withstand voltage definition point islocated at the bottom of the high impurity concentration portion.Therefore, the avalanche current flows in the column region 40, and thegate oxide layer 106A is not damaged.

In the examples shown in row A, B and C of FIG. 16, even if a repetitiveavalanche switching test of high temperature (150 degree centigrade) iscarried out, there is little influence on the gate oxide layer, and thegate oxide capacitance versus voltage characteristics is not shifted.

On the other hand, when the high impurity concentration portion is notformed, the withstand voltage definition point is located at the bottomof the trench gate. Therefore, the avalanche current flows near the gateoxide layer 106A, and the gate oxide layer 106A may be damaged becauseof the avalanche current.

According to the semiconductor apparatus 2 of the second embodiment, thesemiconductor apparatus 2 has a SJ structure which has the column region4 formed in the drift region 102 under the base region 108. Thetrade-off between the break down voltage and the on-resistance isimproved. That is, the withstand voltage characteristics is notdegraded, and the on-resistance can be reduced.

The high impurity concentration portion is formed in this embodiment.Therefore, the electric field intensity is increased partly when thereverse bias voltage is applied. The avalanche breakdown occurspreferentially in the column region 40. The avalanche current producedin the column region 40 directly flows to the source contact via thebase region 108. The avalanche current is not concentrated near the gateelectrode 107A (that is, a portion along the trench 104 of the baseregion 108). The damage to the gate oxide layer 106A can be avoided.

The bottom of the high impurity concentration portion is deeper than thebottom of the gate electrode 107A. When the reverse bias voltage isapplied to the semiconductor apparatus 2, the portion where the electricfield intensity is partly increased is apart form the bottom of thetrench 104. The avalanche current which flows in the column region 4does not flow to near the gate electrode 107A.

In the second embodiment, only one high impurity concentration portionis formed. A plurality of high impurity concentration portions, however,may be formed.

Further, it is possible to combine the first embodiment with the secondembodiment. The column region is divided into a plurality of dividedportions, and one of the divided portions may be a high impurityconcentration portion. For example, the lower part 421 of the seconddivided portion 42 (please refer to FIG. 1) may be the high impurityconcentration region. In this case, a dose amount of boron of the lowerpart 422 is larger than that of the upper part 422.

Further, the trench 103 shown in FIG. 13 may be formed in the secondembodiment.

An N type MOSFET is described in the above embodiments. Even if theconductivity type is reversed, the embodiments are available by changingthe conductive type of each region.

As shown in FIG. 10 and FIG. 16, the slight differences of the withstandvoltages are shown between the embodiments and the conventional powerMOSFET. The slight differences are minute compared with the improvementsof the withstand voltage and on-resistance caused by the SJ structure.

It is apparent that the present invention is not limited to the aboveembodiment, that may be modified and changed without departing from thescope and spirit of the invention.

1. A semiconductor apparatus comprising: a gate electrode; a gateinsulating layer; a drift region of the first conductivity type formedover a semiconductor substrate of the first conductivity type; a baseregion of a second conductivity type formed over the drift region; asource region of the first conductivity type formed on the base region;and a column region formed in the drift region under the base region,the column region having at least one portion having equal to or morethan twice an impurity concentration of an average impurityconcentration of the column region.
 2. The semiconductor apparatusaccording to claim 1, wherein the gate electrode extends from the baseregion to the drift region, the gate electrode is formed in a trenchformed in the drift region.
 3. The semiconductor apparatus according toclaim 2, wherein the portion having the higher impurity concentration isdeeper than a bottom of the trench.
 4. The semiconductor apparatusaccording to claim 1, wherein the part having the higher impurityconcentration includes a bottom of the column region.